| A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology | |
| Peishuai Song; Chaowei Si; Mingliang Zhang; Yongmei Zhao; Yurong He; Wen Liu; Xiaodong Wang | |
| 刊名 | SENSORS
 |
| 2020 | |
| 卷号 | 20期号:2页码:337 |
| 语种 | 英语 |
| 内容类型 | 期刊论文 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/30608]  |
| 专题 | 半导体研究所_半导体集成技术工程研究中心 |
| 推荐引用方式 GB/T 7714 | Peishuai Song;Chaowei Si;Mingliang Zhang;Yongmei Zhao;Yurong He;Wen Liu;Xiaodong Wang. A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology[J]. SENSORS,2020,20(2):337. |
| APA | Peishuai Song;Chaowei Si;Mingliang Zhang;Yongmei Zhao;Yurong He;Wen Liu;Xiaodong Wang.(2020).A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology.SENSORS,20(2),337. |
| MLA | Peishuai Song;Chaowei Si;Mingliang Zhang;Yongmei Zhao;Yurong He;Wen Liu;Xiaodong Wang."A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology".SENSORS 20.2(2020):337. |
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