Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath

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	Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath
	Qiao, M ; Xian, AP ; Shang, JK
刊名	ACTA METALLURGICA SINICA
	2004-08-01
卷号	40 期号:8 页码:822-826
关键词	lead-free solder electroplating Sn-Ag alloy microelectronic packaging
ISSN号	0412-1961
通讯作者	Xian, AP()
英文摘要	In the road-line map of the lead-free soldering for electronic packaging, the development and application of the lead-free solder coating on Cu matrix is a key step. In this paper, an alkaline pyrophosphate bath and the electroplating processing is developed for a Sn-Ag lead-free solder coating. The research results are focused at effects of the bath composition and the processing parameters on silver content and morphology of the coating, the processing parameters include cathodic current density, bath temperature and agitation.
WOS研究方向	Metallurgy & Metallurgical Engineering
语种	英语
出版者	SCIENCE CHINA PRESS
WOS记录号	WOS:000223695400008
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/119017]
专题	金属研究所_中国科学院金属研究所
通讯作者	Xian, AP
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
推荐引用方式 GB/T 7714	Qiao, M,Xian, AP,Shang, JK. Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath[J]. ACTA METALLURGICA SINICA,2004,40(8):822-826.
APA	Qiao, M,Xian, AP,&Shang, JK.(2004).Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath.ACTA METALLURGICA SINICA,40(8),822-826.
MLA	Qiao, M,et al."Electro-deposition of Sn-Ag lead-free solder by alkaline pyrophosphate bath".ACTA METALLURGICA SINICA 40.8(2004):822-826.