| Optoelectronic connectors | |
| EDRIS MOHAMMED; DAOQIANG LU | |
| 2009-05-20 | |
| 著作权人 | INTEL CORPORATION |
| 专利号 | GB2454813A |
| 国家 | 英国 |
| 文献子类 | 发明申请 |
| 其他题名 | Optoelectronic connectors |
| 英文摘要 | A wafer level packaging method for optoelectronic components such as VCSEL arrays and photodetectors, comprises: a semiconductor die having a cavity 102 for receiving a flip-chip mounted optoelectronic component and solder bumps 106 which provide electrical connection to the other side of the die through via interconnections. The via connections contact interconnect traces on the other side of the die which connect to another component such as a microprocessor 900 (see figure 9) A plastic optical connector housing is moulded onto the die and driving circuits for the optoelectronic component may be formed in the surface of the die. |
| 公开日期 | 2009-05-20 |
| 申请日期 | 2008-11-20 |
| 状态 | 授权 |
| 内容类型 | 专利 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/92529]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTEL CORPORATION |
| 推荐引用方式 GB/T 7714 | EDRIS MOHAMMED,DAOQIANG LU. Optoelectronic connectors. GB2454813A. 2009-05-20. |
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