Epoxy composite with significantly improved thermal conductivity by constructing a vertically aligned three-dimensional network of silicon carbide nanowires/ boron nitride nanosheets

doi:10.1016/j.compositesb.2020.107855

	Epoxy composite with significantly improved thermal conductivity by constructing a vertically aligned three-dimensional network of silicon carbide nanowires/ boron nitride nanosheets
	Xiao, Chao 2,3,4; Guo, Yujie 1,5; Tang, Yunlu 2,3,4; Ding, Jiwan 2,3,4; Zhang, Xian 2,4; Zheng, Kang 2,4; Tian, Xingyou 2,4
刊名	COMPOSITES PART B-ENGINEERING
	2020-04-15
卷号	187
关键词	Silicon carbide nanowires Boron nitride nanosheets Vertical alignment Thermal conductivity
ISSN号	1359-8368
DOI	10.1016/j.compositesb.2020.107855
通讯作者	Zheng, Kang(kzheng@issp.ac.cn) ; Tian, Xingyou(xytian@issp.ac.cn)
英文摘要	The trend of miniaturization, integration and multi-function of modern electronics leads to the speedily increased power density which makes heat dissipation a crucial issue. Herein, epoxy based composites with highly enhanced through-plane thermal conductivity were successfully prepared by constructing a free-standing and vertically aligned silicon carbide nanowires (SiCw)/functionalized boron nitride nanosheets (f-BNNS) framework through modified filtration strategy. The synergetic effect between hybrid fillers ensured highly efficient channels for phonons in vertical direction that the maximum thermal conductivity reached 4.22 W/mK at a low hybrid filler loading of 21.9 vol%, increased by 1658% in comparison to that of pure epoxy. Due to the entanglement effect of SiCw/f-BNNS framework and the enhanced interface interaction by BNNS modification, the interfacial thermal resistance between filler/filler and filler/matrix were both reduced a lot compared with random dispersion method. Exceptional heat dissipation capability of the vertically orientated architecture was also demonstrated by theoretical simulation and chip encapsulation applications. In addition, the coefficient of thermal expansion of composite reached as low as 41.1 ppm/degrees C, only half of the epoxy resin (83.5 ppm/degrees C). This work provides a novel strategy for fabricating polymer based composites with superior through-plane thermal conductivity in thermal management applications.
资助项目	National Key Research and Development Program of China[2017YFB0406200] ; Key Project of Science and Technology Service Network Initiative of the Chinese Academy of Sciences[KFJ-STS-ZDTP-069]
WOS关键词	PHASE-CHANGE MATERIAL ; POLYMER COMPOSITES ; NANOCOMPOSITES ; ENHANCEMENT ; MANAGEMENT ; ALIGNMENT ; BN
WOS研究方向	Engineering ; Materials Science
语种	英语
出版者	ELSEVIER SCI LTD
WOS记录号	WOS:000521118100018
资助机构	National Key Research and Development Program of China ; Key Project of Science and Technology Service Network Initiative of the Chinese Academy of Sciences
内容类型	期刊论文
源URL	[http://ir.hfcas.ac.cn:8080/handle/334002/103597]
专题	中国科学院合肥物质科学研究院
通讯作者	Zheng, Kang; Tian, Xingyou
作者单位	1.Chinese Acad Sci, Inst Semicond, Beijing 100083, Peoples R China 2.Chinese Acad Sci, Inst Appl Technol, Hefei Inst Phys Sci, Hefei 230031, Peoples R China 3.Univ Sci & Technol China, Hefei 230036, Peoples R China 4.Chinese Acad Sci, Key Lab Photovolat & Energy Conservat Mat, Hefei 230031, Peoples R China 5.Univ Chinese Acad Sci, Beijing 100049, Peoples R China
推荐引用方式 GB/T 7714	Xiao, Chao,Guo, Yujie,Tang, Yunlu,et al. Epoxy composite with significantly improved thermal conductivity by constructing a vertically aligned three-dimensional network of silicon carbide nanowires/ boron nitride nanosheets[J]. COMPOSITES PART B-ENGINEERING,2020,187.
APA	Xiao, Chao.,Guo, Yujie.,Tang, Yunlu.,Ding, Jiwan.,Zhang, Xian.,...&Tian, Xingyou.(2020).Epoxy composite with significantly improved thermal conductivity by constructing a vertically aligned three-dimensional network of silicon carbide nanowires/ boron nitride nanosheets.COMPOSITES PART B-ENGINEERING,187.
MLA	Xiao, Chao,et al."Epoxy composite with significantly improved thermal conductivity by constructing a vertically aligned three-dimensional network of silicon carbide nanowires/ boron nitride nanosheets".COMPOSITES PART B-ENGINEERING 187(2020).