Decoupling research on a flexible tactile sensor array with novel structure

doi:10.1088/1757-899X/224/1/012045

	Decoupling research on a flexible tactile sensor array with novel structure
	Hu,G Y 1,2; Xu,Y Y 1,2; Pan,H Q 2; Shuang,F 1,2,3
刊名	IOP Conference Series: Materials Science and Engineering
	2017-07-01
卷号	224
ISSN号	1757-8981
DOI	10.1088/1757-899X/224/1/012045
英文摘要	Abstract This paper presents a flexible tactile sensor, which uses a novel structure and effective decoupling method to detect multi-point three-dimensional touch force. Firstly, the structure characteristics of the sensor are introduced. According to the theories of force-sensitive conductive rubber, the relationship between the resistance and the force exerted on the sensor is analyzed. Furthermore the mathematical model of the sensor based on finite element method is conducted. The simulation result is consistent well with the theory result. Then a decoupling method based on the RBF neural network is proposed in order to obtain the force from the resistance. The research indicates that the flexible tactile sensor with the novel structure and the decoupling method can accurately detect the three-dimensional force.
语种	英语
出版者	IOP Publishing
WOS记录号	IOP:1757-8981-224-1-012045
内容类型	期刊论文
源URL	[http://ir.hfcas.ac.cn:8080/handle/334002/43031]
专题	中国科学院合肥物质科学研究院
作者单位	1.Department of Automation, University of Science and Technology of China, Hefei, China 2.Institute of Intelligent Machines, Chinese Academy of Sciences, Hefei, China 3.Department of Mechanical Engineering, Anhui Polytechnic University, Wuhu, China
推荐引用方式 GB/T 7714	Hu,G Y,Xu,Y Y,Pan,H Q,et al. Decoupling research on a flexible tactile sensor array with novel structure[J]. IOP Conference Series: Materials Science and Engineering,2017,224.
APA	Hu,G Y,Xu,Y Y,Pan,H Q,&Shuang,F.(2017).Decoupling research on a flexible tactile sensor array with novel structure.IOP Conference Series: Materials Science and Engineering,224.
MLA	Hu,G Y,et al."Decoupling research on a flexible tactile sensor array with novel structure".IOP Conference Series: Materials Science and Engineering 224(2017).