QQ客服 官方微博 反馈留言

	Semiconductor laser device
	TANAKA HARUO
	1992-02-18
著作权人	ローム株式会社
专利号	JP1992048671A
国家	日本
文献子类	发明申请
其他题名	Semiconductor laser device
英文摘要	PURPOSE:To eliminate the need for air tightness for sealing transparent board to a cap body by charging transparent resin between a semiconductor laser chip and the transparent board to cover all over the semiconductor laser chip. CONSTITUTION:In a semiconductor laser device 1 which is composed of a stem 2 and metallic cap body 4 such as carbon steel provided with a transparent plate 3 such as glass, relatively soft transparent resin 12 such as silicon resin is charged between the transparent plate 3 and a semiconductor laser chip 8 by the transparent resin 12 to cover all over the semiconductor laser chip 8 and said waveguide 9. As a result, laser beam which is projected from a front cleavage surface 8a at an end of the semiconductor laser chip 8 passes through the inside of the transparent resin 12 and is projected to atmosphere through a surface of the transparent plate 3. Meanwhile, since an entire of the semiconductor laser chip 8 is covered with the transparent resin 12, humidity and dust are prevented from coming into contact with the semiconductor laser chip 8.
公开日期	1992-02-18
申请日期	1990-06-14
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/80978]
专题	半导体激光器专利数据库
作者单位	ローム株式会社
推荐引用方式 GB/T 7714	TANAKA HARUO. Semiconductor laser device. JP1992048671A. 1992-02-18.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。