Manufacture of semiconductor device
KITAMURA MITSUHIRO
1988-10-05
著作权人NEC CORP
专利号JP1988240089A
国家日本
文献子类发明申请
其他题名Manufacture of semiconductor device
英文摘要PURPOSE:To inhibit the precipitation of a polycrystal onto an insulating film by elevating the temperature of formation of the insulating film for selective growth to 180 deg.C or more when a high-resistance semiconductor layer is vapor-grown. CONSTITUTION:In the manufacture of a semiconductor device in which a semiconductor layer is epitaxial-grown selectively by using an insulating film 5 through vapor growth, the insulating film 5 is formed at a temperature of 180 deg.C or more. That is, the degree of the precipitation of a polycrystal 9 onto the insulating film 5 largely depends upon the method of the formation of the insulating film 5. When an SiNx film is shaped through a plasma CVD method and the film is used as a mask for selective growth, a temperature of approximately 180 deg.C is employed as a boundary, and the precipitation of the polycrystal 9 is increased at a temperature lower than the temperature, but precipitation is reduced comparatively at a temperature higher than that, and the polycrystal can be removed sufficiently after growth. Accordingly, the deterioration of yield on manufacture due to the insufficient removal of the polycrystal 9 at the time when a high-resistance layer 8 is grown is prevented. The method can also be applied to the manufacture of an LED, a photo-detector and an integrated device.
公开日期1988-10-05
申请日期1987-03-27
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/77999]  
专题半导体激光器专利数据库
作者单位NEC CORP
推荐引用方式
GB/T 7714
KITAMURA MITSUHIRO. Manufacture of semiconductor device. JP1988240089A. 1988-10-05.
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