Manufacture of semiconductor laser
NOGUCHI HIDEAKI
1985-07-01
著作权人NIPPON ELECTRIC CO
专利号JP1985123086A
国家日本
文献子类发明申请
其他题名Manufacture of semiconductor laser
英文摘要PURPOSE:To cut a laser array element into several laser element without deteriorating characteristics by scribing only a substrate-side surfce separate from side surfaces for mirror surfaces by specific size or more by a scribing point in parallel with scribing among striped light-emitting regions and light-emitting regions for the laser array element and dividing the laser array element into several semiconductor laser element. CONSTITUTION:A bar shaped semiconductor laser array element 21 to which mirror surfaces 15, 16 for feeding back beams through cleavage is scribed by a scribing point 35 only in sections 34 separate from the side surfaces 15, 16 for mirror surfaces of a substrate-side surface 33 by 10mum or more among striped light-emitting regions 31 and adjacent light-emitting regions 32, and cut into each semiconductor laser element 36. It is important that the semiconductor laser array element must be cut by using the scribing point in the first point, only the substrate-side surfaces 34 must be scribed by the scribing point and the side surfaces of epitaxial growth layers 13, 14 need not be scribed in the second point and substrate-side surface 37 sections within 10mum from the side surfaces for the mirror surfaces need not be scribed in the third point at that time.
公开日期1985-07-01
申请日期1983-12-08
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/77933]  
专题半导体激光器专利数据库
作者单位NIPPON ELECTRIC CO
推荐引用方式
GB/T 7714
NOGUCHI HIDEAKI. Manufacture of semiconductor laser. JP1985123086A. 1985-07-01.
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