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	Micro-transfer-printable flip-chip structures and methods
	BOWER, CHRISTOPHER; MEITL, MATTHEW; TRINDADE, ANTÓNIO JOSÉ MARQUES; COK, RONALD S.; RAYMOND, BROOK; PREVATTE, CARL
	2019-10-01
著作权人	X-CELEPRINT LIMITED
专利号	US10431487
国家	美国
文献子类	授权发明
其他题名	Micro-transfer-printable flip-chip structures and methods
英文摘要	In certain embodiments, a method of making a semiconductor structure suitable for transfer printing (e.g., micro-transfer printing) includes providing a support substrate and disposing and processing one or more semiconductor layers on the support substrate to make a completed semiconductor device. A patterned release layer and, optionally, a capping layer are disposed on or over the completed semiconductor device and the patterned release layer or capping layer, if present, are bonded to a handle substrate with a bonding layer. The support substrate is removed to expose the completed semiconductor device and, in some embodiments, a portion of the patterned release layer. In some embodiments, an entry path is formed to expose a portion of the patterned release layer. In some embodiments, the release layer is etched and the completed semiconductor devices transfer printed (e.g., micro-transfer printed) from the handle substrate to a destination substrate.
公开日期	2019-10-01
申请日期	2018-11-15
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/72343]
专题	半导体激光器专利数据库
作者单位	X-CELEPRINT LIMITED
推荐引用方式 GB/T 7714	BOWER, CHRISTOPHER,MEITL, MATTHEW,TRINDADE, ANTÓNIO JOSÉ MARQUES,et al. Micro-transfer-printable flip-chip structures and methods. US10431487. 2019-10-01.

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