Manufacture of buried heterosemiconductor laser
KUNIHARA KENJI
1988-09-16
著作权人FUJI ELECTRIC CO LTD
专利号JP1988222486A
国家日本
文献子类发明申请
其他题名Manufacture of buried heterosemiconductor laser
英文摘要PURPOSE:To reduce an amount of side etching at the time of etching, by removing an active layer and a thin second clad layer grown in the first grow process by etching followed by forming the active layer in a buried manner in a photoetching process. CONSTITUTION:A first clad layer C1, an active layer A and a second clad layer C2 having smaller thickness than that of the first clad layer C1 are formed by turns on a substrate S. Next, photoetching is performed while leaving a mesa including a stripe-shaped active layer of fixed width until the first clad layer C1 is reached. Further, the third clad layer C3 is selectively grown in the region removed by photoetching until reaching the top surface of the second clad layer C2 of the said mesa for burying the active layer A in the clad layer. Finally, the fourth clad layer C4 and a contact layer Ep are formed on these layers. In this way, depth of etching necessary for forming the mesa is reduced to 1/10 compared with existing ones so as to be able to suppress the amount of side etching at the time of etching to a small amount.
公开日期1988-09-16
申请日期1987-03-11
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/67695]  
专题半导体激光器专利数据库
作者单位FUJI ELECTRIC CO LTD
推荐引用方式
GB/T 7714
KUNIHARA KENJI. Manufacture of buried heterosemiconductor laser. JP1988222486A. 1988-09-16.
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