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	Sub-mount for optical semiconductor element
	ANDO SHINJI
	1989-05-26
著作权人	MITSUBISHI ELECTRIC CORP
专利号	JP1989134983A
国家	日本
文献子类	发明申请
其他题名	Sub-mount for optical semiconductor element
英文摘要	PURPOSE:To prevent a defect from occuring in a monitoring current of a laser diode due to a surface roughness of a solder during the assembly of the diode by a method wherein a step is provided to a surface of a sub-mount on a semiconductor laser chip side. CONSTITUTION:A Si conductive sub-mount base 2 is mounted on a heat dissipating metal block 3. Furthermore, a semiconductor laser chip 1 is mounted on the base 2. A step 2a is formed on the surface of the base 2 on the chip side, and the part of the surface of the base 2 behind the rear end face of the chip 1 is made to be lower than the junction face of the sub-mount 2 with the chip 1 by 20-30mum. Concerning the sub-mount 2 shaped as mentioned above, even if a protrusion is generated on the surface of a Sn solder layer 4c, a light emitting point of the chip 1 is prevented from being screened owing to the step 2a, so that a defective monitoring current is prevented.
公开日期	1989-05-26
申请日期	1987-11-19
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/63118]
专题	半导体激光器专利数据库
作者单位	MITSUBISHI ELECTRIC CORP
推荐引用方式 GB/T 7714	ANDO SHINJI. Sub-mount for optical semiconductor element. JP1989134983A. 1989-05-26.

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