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	Burn-in preform and method of making the same
	GROSS, THOMAS R.; JARRETT, ROBERT; LANZA, JR., ANTHONY D.; MERRITT, CRAIG K.
	2019-05-02
著作权人	INDIUM CORPORATION
专利号	US20190128953A1
国家	美国
文献子类	发明申请
其他题名	Burn-in preform and method of making the same
英文摘要	Some implementations are directed to a burn-in solder preform including: a barrier layer to prevent thermally conductive material from adhering to a semiconductor component during burn-in testing; and a thermally conductive cladding layer attached to a portion of the barrier layer such that at least one dimension of the barrier layer extends past the thermally conductive cladding layer, where the thermally conductive cladding layer is attached over the barrier layer through continuous attachment or spot attachment. In some implementations, a method includes: placing the aforementioned burn-in solder preform between a test fixture and a semiconductor component; attaching a portion of the barrier layer of the burn-in solder preform to a head of the text fixture; and after attaching a portion of the barrier layer of the burn-in solder preform to the head of the test fixture, performing burn-in testing of the semiconductor component.
公开日期	2019-05-02
申请日期	2018-10-30
状态	申请中
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/62586]
专题	半导体激光器专利数据库
作者单位	INDIUM CORPORATION
推荐引用方式 GB/T 7714	GROSS, THOMAS R.,JARRETT, ROBERT,LANZA, JR., ANTHONY D.,et al. Burn-in preform and method of making the same. US20190128953A1. 2019-05-02.

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