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	Optical sensor package including a cavity formed in an image sensor die
	RENARD, LOIC PIERRE LOUIS; ANG, CHENG-LAY
	2018-05-31
著作权人	STMICROELECTRONICS PTE LTD
专利号	US20180151772A1
国家	美国
文献子类	发明申请
其他题名	Optical sensor package including a cavity formed in an image sensor die
英文摘要	One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate, and a recess is formed extending into the image sensor die from the first surface toward a second surface of the image sensor die. A light transmissive layer is formed in the image sensor die between the recess and the first surface. The optical sensor further includes a light-emitting device that is coupled to the substrate and positioned within the recess formed in the image sensor die.
公开日期	2018-05-31
申请日期	2018-01-25
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/57688]
专题	半导体激光器专利数据库
作者单位	STMICROELECTRONICS PTE LTD
推荐引用方式 GB/T 7714	RENARD, LOIC PIERRE LOUIS,ANG, CHENG-LAY. Optical sensor package including a cavity formed in an image sensor die. US20180151772A1. 2018-05-31.

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