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	Interfacing chip on glass assembly
	MIZRAHI, IDAN; MACICA, STEPHEN, JOHN
	2017-11-16
著作权人	FINISAR CORPORATION
专利号	WO2017196577A1
国家	世界知识产权组织
文献子类	发明申请
其他题名	Interfacing chip on glass assembly
英文摘要	In one example embodiment, an optoelectronic assembly (200) includes an electronic substrate (208), a transparent component (202) coupled on a first side of the electronic substrate, and a first component (210) which may be formed of or may include nickel plated copper coupled to a second side of the electronic substrate opposite the first side. The electronic substrate, the transparent component, and the first component may define a hermetically sealed enclosure (244). A laser array (232) or a receiver array (236) may be mechanically coupled to the transparent component inside of the enclosure and oriented to transmit or receive optical signals through the transparent component. The laser array or the receiver array may be electrically coupled to the electronic substrate. A second component (214) may be positioned between the first component and the transparent component in the hermetically sealed enclosure with a thermal interface material forming a first interface between the second component and the transparent component.
公开日期	2017-11-16
申请日期	2017-05-01
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/57577]
专题	半导体激光器专利数据库
作者单位	FINISAR CORPORATION
推荐引用方式 GB/T 7714	MIZRAHI, IDAN,MACICA, STEPHEN, JOHN. Interfacing chip on glass assembly. WO2017196577A1. 2017-11-16.

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