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	Multi stack optical elements using temporary and permanent bonding
	GODET, LUDOVIC; MCMILLAN, WAYNE; MEYER TIMMERMAN THIJSSEN, RUTGER; ARGAMAN, NAAMAH; ROY, TAPASHREE; DOSHAY, SAGE
	2019-10-17
著作权人	APPLIED MATERIALS, INC.
专利号	US20190318957A1
国家	美国
文献子类	发明申请
其他题名	Multi stack optical elements using temporary and permanent bonding
英文摘要	Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.
公开日期	2019-10-17
申请日期	2019-02-22
状态	申请中
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/57266]
专题	半导体激光器专利数据库
作者单位	APPLIED MATERIALS, INC.
推荐引用方式 GB/T 7714	GODET, LUDOVIC,MCMILLAN, WAYNE,MEYER TIMMERMAN THIJSSEN, RUTGER,et al. Multi stack optical elements using temporary and permanent bonding. US20190318957A1. 2019-10-17.

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