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	Optical semiconductor package and method for manufacturing the same
	WANG, CHUEI-TANG; CHANG, CHIH-CHIEH; LIAO, YU-KUANG; HSIA, HSING-KUO; CHANG, CHIH-YUAN; HSIEH, JENG-SHIEN; YU, CHEN-HUA
	2019-05-02
著作权人	TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
专利号	US20190131267A1
国家	美国
文献子类	发明申请
其他题名	Optical semiconductor package and method for manufacturing the same
英文摘要	A semiconductor package includes an interconnect structure having a first surface and a second surface opposite to the first surface, at least one optical chip over the first surface of the interconnect structure and electrically coupled to the interconnect structure, an insulating layer contacting the second surface of the interconnect structure, and a molding compound over the first surface of the interconnect structure. The insulating layer includes a third surface facing the second surface of the interconnect structure and a fourth surface opposite to the third surface. At least an edge of the optical chip is covered by the molding compound.
公开日期	2019-05-02
申请日期	2017-10-27
状态	申请中
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54830]
专题	半导体激光器专利数据库
作者单位	TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
推荐引用方式 GB/T 7714	WANG, CHUEI-TANG,CHANG, CHIH-CHIEH,LIAO, YU-KUANG,et al. Optical semiconductor package and method for manufacturing the same. US20190131267A1. 2019-05-02.

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