Light-emission module having cooler and production method for light-emission module having cooler
NAGASE TOSHIYUKI; KOMASAKI MASAHITO; IWAZAKI WATARU
2018-08-01
著作权人MITSUBISHI MATERIALS CORPORATION
专利号EP3355372A1
国家欧洲专利局
文献子类发明申请
其他题名Light-emission module having cooler and production method for light-emission module having cooler
英文摘要A light-emitting module with a cooler of the present invention includes a circuit layer which is formed on one surface side of an insulating layer and in which a light-emitting element is mounted, and a metal layer and a cooler which are laminated in order on the other surface side of the insulating layer. The circuit layer is formed of Cu, Al, or an alloy thereof and has a thickness of 0.1 mm or less. The metal layer and the cooler are formed of Al or an Al alloy. The metal layer and the cooler are directly bonded to each other. The ratio of the area of the light-emitting element to the area of the one surface of the insulating layer is within a range from 1:20 to 1:400.
公开日期2018-08-01
申请日期2016-09-20
状态申请中
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/54731]  
专题半导体激光器专利数据库
作者单位MITSUBISHI MATERIALS CORPORATION
推荐引用方式
GB/T 7714
NAGASE TOSHIYUKI,KOMASAKI MASAHITO,IWAZAKI WATARU. Light-emission module having cooler and production method for light-emission module having cooler. EP3355372A1. 2018-08-01.
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