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	Light-emitting module substrate, light-emitting module, substrate for light-emitting module having cooler, and production method for light-emitting module substrate
	NAGASE TOSHIYUKI; KOMASAKI MASAHITO; IWAZAKI WATARU
	2018-08-01
著作权人	MITSUBISHI MATERIALS CORPORATION
专利号	EP3355370A1
国家	欧洲专利局
文献子类	发明申请
其他题名	Light-emitting module substrate, light-emitting module, substrate for light-emitting module having cooler, and production method for light-emitting module substrate
英文摘要	A light-emitting module substrate of the present invention includes a circuit layer which is formed on one surface of an insulating layer and in which a light-emitting element is mounted, and a metal layer formed of Al or an Al alloy and a heat sink which are laminated in order on the other surface side of the insulating layer. In the heat sink, Cu is present on at least a bonding surface with respect to the metal layer. The metal layer and the heat sink are subjected to solid-phase diffusion bonding on the bonding surface. The thickness of the circuit layer is 0.1 mm or less.
公开日期	2018-08-01
申请日期	2016-09-20
状态	申请中
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54730]
专题	半导体激光器专利数据库
作者单位	MITSUBISHI MATERIALS CORPORATION
推荐引用方式 GB/T 7714	NAGASE TOSHIYUKI,KOMASAKI MASAHITO,IWAZAKI WATARU. Light-emitting module substrate, light-emitting module, substrate for light-emitting module having cooler, and production method for light-emitting module substrate. EP3355370A1. 2018-08-01.

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