Optical transceiver by fowlp and dop multichip integration
DING, LIANG; NAGARAJAN, RADHAKRISHNAN L.; COCCIOLI, ROBERTO
2017-09-07
著作权人INPHI CORPORATION
专利号US20170254968A1
国家美国
文献子类发明申请
其他题名Optical transceiver by fowlp and dop multichip integration
英文摘要An optical transceiver by hybrid multichip integration. The optical transceiver includes a PCB with a plurality of prefabricated surface bonding sites. A first chip includes a FOWLP package of multiple electronics devices embedded in a dielectric molding layer overlying a dielectric redistribution layer is disposed on the PCB by respectively bonding a plurality of conductor balls between the dielectric redistribution layer and the plurality of prefabricated surface bonding sites while exposing soldering material filled in multiple through-mold vias (TMVs) in the dielectric molding layer. The optical transceiver further includes a second chip configured as a Sipho die comprising photonics devices embedded in a SOI wafer substantially free from any electronics device process. The second chip is stacked over the first chip with multiple conductor bumps being bonded respectively to the soldering material in the multiple TMVs.
公开日期2017-09-07
申请日期2016-03-04
状态授权
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/54667]  
专题半导体激光器专利数据库
作者单位INPHI CORPORATION
推荐引用方式
GB/T 7714
DING, LIANG,NAGARAJAN, RADHAKRISHNAN L.,COCCIOLI, ROBERTO. Optical transceiver by fowlp and dop multichip integration. US20170254968A1. 2017-09-07.
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