QQ客服 官方微博 反馈留言

	Heat-dissipating substrate and method for manufacturing same
	FUKUI, AKIRA
	2017-10-11
著作权人	SUPERUFO291 TEC
专利号	EP3229268A1
国家	欧洲专利局
文献子类	发明申请
其他题名	Heat-dissipating substrate and method for manufacturing same
英文摘要	A heat dissipation substrate having the maximum value of the coefficient of linear expansion of 10 ppm/K or less in any direction in a plane parallel to the surface within a temperature range from room temperature to 800°C as well as a thermal conductivity of 250 W/m•K or higher at 200°C is produced by densifying an alloy composite of CuMo or CuW composed of Cu and coarse powder of Mo or W and subsequently cross-rolling the same alloy composite.
公开日期	2017-10-11
申请日期	2015-11-27
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54641]
专题	半导体激光器专利数据库
作者单位	SUPERUFO291 TEC
推荐引用方式 GB/T 7714	FUKUI, AKIRA. Heat-dissipating substrate and method for manufacturing same. EP3229268A1. 2017-10-11.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。