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	Dissipating heat from electronic devices
	ANOLIK, RAMI; HAZANI, AMI; MAGNEZI, GAVRIEL; ROSENFELDER, PINHAS YEHUDA
	2015-07-16
著作权人	CORNING OPTICAL COMMUNICATIONS WIRELESS LTD.
专利号	WO2015104715A1
国家	世界知识产权组织
文献子类	发明申请
其他题名	Dissipating heat from electronic devices
英文摘要	An electronic apparatus includes first and second electronic devices (10,12), and first and second heat sinks (14,16) for dissipating heat, wherein there is each of electrical conductivity between the first electronic device (10) which may be an electrical power amplifier and the first heat sink (14), thermal conductivity between the first electronic device and the first heat sink, electrical conductivity between the second electronic device (12) which may be a laser diode and the second heat sink (16), and thermal conductivity between the second electronic device and the second heat sink, wherein electrical conductivity is provided between the first and second heat sinks (14,16) with an electrical bridge (22) which may be a thin copper stripe like used for PCB. A thermal resistance is provided between the first and second heat sinks (14,16) by for example a gap (20), so that the second heat sink (16) of the laser diode (12) remains cooler than the first heat (14) of its electrical driver (10), such as for protecting the second electrical device from the heat generated by the first electronic device. The heat sinks may have fins (17) for improving heat transfer to the environment.
公开日期	2015-07-16
申请日期	2015-01-13
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54556]
专题	半导体激光器专利数据库
作者单位	CORNING OPTICAL COMMUNICATIONS WIRELESS LTD.
推荐引用方式 GB/T 7714	ANOLIK, RAMI,HAZANI, AMI,MAGNEZI, GAVRIEL,et al. Dissipating heat from electronic devices. WO2015104715A1. 2015-07-16.

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