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	Encapsulating agent for optical semiconductor devices, and optical semiconductor device using same
	TANIKAWA, MITSURU; WATANABE, TAKASHI; INUI, OSAMU; KUNIHIRO, YOSHITAKA; YAMAZAKI, RYOSUKE; KOBAYASHI, YUSUKE
	2013-08-29
著作权人	SEKISUI CHEMICAL CO., LTD.
专利号	US20130221400A1
国家	美国
文献子类	发明申请
其他题名	Encapsulating agent for optical semiconductor devices, and optical semiconductor device using same
英文摘要	Provided is an encapsulant for optical semiconductor devices, which is capable of enhancing the adhesion between a housing and the encapsulant when an optical semiconductor device is encapsulated in the housing, and which is also capable of enhancing the bonding reliability with respect to humidity. The encapsulant for optical semiconductor devices includes: a first organopolysiloxane having an alkenyl group bonded to a silicon atom and an aryl group bonded to a silicon atom, but not having a hydrogen atom bonded to a silicon atom; a second organopolysiloxane having a hydrogen atom bonded to a silicon atom and an aryl group bonded to a silicon atom; a catalyst for hydrosilylation reaction; and an organic compound having a titanium atom.
公开日期	2013-08-29
申请日期	2011-09-15
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/54269]
专题	半导体激光器专利数据库
作者单位	SEKISUI CHEMICAL CO., LTD.
推荐引用方式 GB/T 7714	TANIKAWA, MITSURU,WATANABE, TAKASHI,INUI, OSAMU,et al. Encapsulating agent for optical semiconductor devices, and optical semiconductor device using same. US20130221400A1. 2013-08-29.

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