QQ客服 官方微博 反馈留言

	Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
	IBBETSON, JAMES; KELLER, BERND; PARIKH, PRIMIT
	2006-01-12
著作权人	CREE, INC.
专利号	WO2006005062A2
国家	世界知识产权组织
文献子类	发明申请
其他题名	Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
英文摘要	A packaged light emitting device includes a carrier substrate (20) having a top surface and a bottom surface, first and second conductive vias (22S, B) extending from the top surface of the substrate (20) to the bottom surface of the substrate, and a bond pad (24) on the top surface of the substrate in electrical contact with the first conductive via (22A). A diode (16) having first and second electrodes is mounted on the bond pad with the first electrode (26) is in electrical contact with the bond pad (24). A passivation layer (32) is formed on the diode (16), exposing the second electrode of the diode (16). A conductive trace (33) is formed on the top surface of the carrier substrate in electrical contact with the second conductive via (22B) and the second electrode. The conductive trace is on and extends across the passivation layer to contact the second electrode. Methods of packaging light emitting devices include providing an epiwafer including a growth substrate and an epitaxial structure on the growth substrate, bonding a carrier substrate to the epitaxial structure of the epiwafer, forming a plurality of conductive vias through the carrier substrate, defining a plurality of isolated diodes in the epitaxial structure, and electrically connecting at least one conductive via to respective ones of the plurality of isolated diodes.
公开日期	2006-01-12
申请日期	2005-06-30
状态	未确认
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53685]
专题	半导体激光器专利数据库
作者单位	CREE, INC.
推荐引用方式 GB/T 7714	IBBETSON, JAMES,KELLER, BERND,PARIKH, PRIMIT. Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices. WO2006005062A2. 2006-01-12.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。