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	Semiconductor cooling device and stack of semiconductor cooling devices
	YOSHIOKA, HOKICHI; YAMAOKA, TAKAYUKI; SENOO, SATOSHI
	2006-10-04
著作权人	TECNISCO LIMITED
专利号	EP1708322A1
国家	欧洲专利局
文献子类	发明申请
其他题名	Semiconductor cooling device and stack of semiconductor cooling devices
英文摘要	To prevent occurrence of distortion in semiconductor cooling device and to prevent the semiconductor chip from being separated away from the semiconductor cooling device in case the semiconductor chip and the semiconductor cooling device are thermally expanded, a semiconductor cooling device (4) includes at least an upper plate (100a, 100b), an intermediate plate (3) and a lower plate (200a, 200b), and has a coolant inlet portion (101), an outlet portion (202) and a flow passage portion (31). The upper plate (100a, 100b) and the lower plate (200a, 200b) are composite plates constituted by plating copper maintaining a thickness of not smaller than 0.05 mm on one surface or on both surfaces of auxiliary plates (1 and 2) made of a material having a tensile strength of not smaller than 1000 N/mm2, a heat conductivity of not smaller than 100 W/m·K and a coefficient of thermal expansion of not larger than 6.0 ppm/°C (Fig. 4).
公开日期	2006-10-04
申请日期	2005-03-30
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/53612]
专题	半导体激光器专利数据库
作者单位	TECNISCO LIMITED
推荐引用方式 GB/T 7714	YOSHIOKA, HOKICHI,YAMAOKA, TAKAYUKI,SENOO, SATOSHI. Semiconductor cooling device and stack of semiconductor cooling devices. EP1708322A1. 2006-10-04.

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