QQ客服 官方微博 反馈留言

	Method and apparatus for stress pulsed release and actuation of micromechanical structures
	KAAJAKARI, VILLE; LAL, AMIT
	2000-12-28
著作权人	WISCONSIN ALUMNI RESEARCH FOUNDATION
专利号	AU2000053074A1
国家	澳大利亚
文献子类	发明申请
其他题名	Method and apparatus for stress pulsed release and actuation of micromechanical structures
英文摘要	Micromechanical parts are freed from a surface of a substrate to which the parts are stiction bonded by applying a pulse stress wave to the substrate that propagates through the substrate and is reflected at the surface to which the micropart is stiction bonded, breaking the bond between the micropart and the substrate surface by a spalling action at the surface. A piezoelectric transducer may be secured to the bottom surface of the substrate such that a voltage pulse supplied to the piezoelectric transducer deforms the piezoelectric element and the substrate to which it is secured to provide a pulse stress wave that propagates through the substrate to the top surface. For microparts that are in contact with but not stiction bonded to the substrate top surface, a pulse stress wave can be applied to the substrate to drive the microparts away from the surface by the rapid displacement of that surface as the pulse stress wave is reflected at the surface. Microparts that are attached to the surface in a way to permit rotation or a translation of movement may be activated by applying a pulse stress wave to the substrate to drive such parts away from contact with the surface into their erected positions.
公开日期	2000-12-28
申请日期	2000-06-01
状态	失效
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/52257]
专题	半导体激光器专利数据库
作者单位	WISCONSIN ALUMNI RESEARCH FOUNDATION
推荐引用方式 GB/T 7714	KAAJAKARI, VILLE,LAL, AMIT. Method and apparatus for stress pulsed release and actuation of micromechanical structures. AU2000053074A1. 2000-12-28.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。