Optoelectronic device encapsulant
KUCZYNSKI, JOSEPH PAUL
2002-03-12
著作权人INTERNATIONAL BUSINESS MACHINES CORPORATION
专利号US6356686
国家美国
文献子类授权发明
其他题名Optoelectronic device encapsulant
英文摘要An optically clear encapsulant for optoelectronic packages exhibits a suitably high viscosity both to replace a silicon nitride passivation layer required on a VCSEL die and to fill a gap between the die and an optical coupler, preventing light signal degradation. The encapsulant exhibits optical transparency to light having a wavelength of about 850 nanometers (nm) with substantially no Mie scattering since particulate fillers are not required to modulate viscosity in the encapsulant. Also, the encapsulant further seals wire bonds between the die and a cable header to prevent abrasive wear. The gap-filling encapsulant is particularly suitable for use with vertical cavity surface emitting laser (VCSEL) technology. The encapsulant includes prior to curing, a difunctional acrylate epoxy resin exhibiting pseudoplastic flow and a viscosity of greater than about 0.7x106 centipoise. Accordingly, a method of manufacturing an optical subassembly may eliminate a separate passivation step and instead fill the gap between the die and optical coupler with an optically clear encapsulant.
公开日期2002-03-12
申请日期1999-09-03
状态失效
内容类型专利
源URL[http://ir.opt.ac.cn/handle/181661/50390]  
专题半导体激光器专利数据库
作者单位INTERNATIONAL BUSINESS MACHINES CORPORATION
推荐引用方式
GB/T 7714
KUCZYNSKI, JOSEPH PAUL. Optoelectronic device encapsulant. US6356686. 2002-03-12.
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