Optoelectronic device encapsulant | |
KUCZYNSKI, JOSEPH PAUL | |
2002-03-12 | |
著作权人 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
专利号 | US6356686 |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | Optoelectronic device encapsulant |
英文摘要 | An optically clear encapsulant for optoelectronic packages exhibits a suitably high viscosity both to replace a silicon nitride passivation layer required on a VCSEL die and to fill a gap between the die and an optical coupler, preventing light signal degradation. The encapsulant exhibits optical transparency to light having a wavelength of about 850 nanometers (nm) with substantially no Mie scattering since particulate fillers are not required to modulate viscosity in the encapsulant. Also, the encapsulant further seals wire bonds between the die and a cable header to prevent abrasive wear. The gap-filling encapsulant is particularly suitable for use with vertical cavity surface emitting laser (VCSEL) technology. The encapsulant includes prior to curing, a difunctional acrylate epoxy resin exhibiting pseudoplastic flow and a viscosity of greater than about 0.7x106 centipoise. Accordingly, a method of manufacturing an optical subassembly may eliminate a separate passivation step and instead fill the gap between the die and optical coupler with an optically clear encapsulant. |
公开日期 | 2002-03-12 |
申请日期 | 1999-09-03 |
状态 | 失效 |
内容类型 | 专利 |
源URL | [http://ir.opt.ac.cn/handle/181661/50390] |
专题 | 半导体激光器专利数据库 |
作者单位 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
推荐引用方式 GB/T 7714 | KUCZYNSKI, JOSEPH PAUL. Optoelectronic device encapsulant. US6356686. 2002-03-12. |
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