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	Integration and alignment of VCSEL's with MEMS using micromachining and flip-chip techniques
	SUN, DECAI; ROSA, MICHEL A.
	2003-11-11
著作权人	XEROX CORPORATION
专利号	US6647036
国家	美国
文献子类	授权发明
其他题名	Integration and alignment of VCSEL's with MEMS using micromachining and flip-chip techniques
英文摘要	A micro-electromechanical system assembly is designed to integrate a laser. More particularly, laser is a vertical cavity surface-emitting laser. The MEMS assembly includes a micro-electromechanical substrate having an upper surface and a lower surface, the upper surface defined as having a first area and a second area. A first substrate bonding pad is positioned on the upper surface at a location within the first area, and a second substrate bonding pad is positioned on the upper surface at a location within the second area. Deposited upon the first and second substrate bonding areas are respective first and second solder material. A laser to be integrated in the MEMS assembly has a first laser bonding pad located on a first side, and a second laser bonding pad located on a second side. The laser is placed between the first substrate bonding pad and second substrate bonding pad such that they align with the respective first and second laser bonding pads. Upon a reflow of the solder material, a precise alignment of the laser is obtained while the reflow process occurs, and at the same time providing a mechanical and electrical connection between the bonding pads. In a further embodiment, the MEMS substrate is configured with a trench portion into which is placed the laser having the first and second laser bonding pads. Placement in the trench, is at least one of a 45° and 54.74° angle. Upon reflow of solder material on the substrate, the laser is finely positioned and held mechanically stable. In a further embodiment, the trench previously described includes a spring mechanism which carries a substrate bonding pad. The spring mechanism causing the laser within the trench to be maintained in a preferred position during and after the solder reflow process. Still yet another embodiment employs bimetallic cantilevers for positioning the laser and electrical interconnect.
公开日期	2003-11-11
申请日期	2000-12-06
状态	授权
内容类型	专利
源URL	[http://ir.opt.ac.cn/handle/181661/48614]
专题	半导体激光器专利数据库
作者单位	XEROX CORPORATION
推荐引用方式 GB/T 7714	SUN, DECAI,ROSA, MICHEL A.. Integration and alignment of VCSEL's with MEMS using micromachining and flip-chip techniques. US6647036. 2003-11-11.

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