A practical package technique for FBG-based temperature independent sensor

CORC > 半导体研究所 > 中国科学院半导体研究所 > 中国科学院半导体研究所（2009年前）

	A practical package technique for FBG-based temperature independent sensor
	Tian, K ; Liu, YL ; Wang, QM
	2004
会议名称	7th international conference on solid-state and integrated circuits technology
会议日期	oct 18-21, 2004
会议地点	beijing, peoples r china
关键词	GRATINGS
页码	vols 1- 3 proceedings: 1908-1910
通讯作者	tian, k, chinese acad sci, inst semicond, res & dev ctr optoelect, beijing 100083, peoples r china.
中文摘要	a practical package technique for temperature independent fiber bragg grating sensor is proposed. a uniform strength cantilever with two fbg attached on the upper and lower surfaces was utilized as the key element. by detecting two wavelengths differential output, the applied force can be obtained and temperature effects can be eliminated. experiment results show the sensor has linear response and output signal uctuates less than 12pm as temperature changes from -10 degrees c to 50 degrees c. the maximum thermal error is less than 0.3% of the full measurement range.
英文摘要	a practical package technique for temperature independent fiber bragg grating sensor is proposed. a uniform strength cantilever with two fbg attached on the upper and lower surfaces was utilized as the key element. by detecting two wavelengths differential output, the applied force can be obtained and temperature effects can be eliminated. experiment results show the sensor has linear response and output signal uctuates less than 12pm as temperature changes from -10 degrees c to 50 degrees c. the maximum thermal error is less than 0.3% of the full measurement range.; zhangdi于2010-03-29批量导入; made available in dspace on 2010-03-29t06:06:33z (gmt). no. of bitstreams: 1 2432.pdf: 143752 bytes, checksum: 23ff02df085b323eaae55d5dacfc58f4 (md5) previous issue date: 2004; chinese inst elect.; ieee beijing sect.; ieee elect devices soc.; ieee eds beijing chapter.; ieee solid-state circuits soc.; ieee sscs beijing chapter.; japan soc appl phys.; iee elect div.; ursi commiss d.; inst elect engineers korea.; natl nat sci fdn china.; beijing municipal bureau ind dev.; peking univ.; chinese acad sci, inst semicond, res & dev ctr optoelect, beijing 100083, peoples r china
收录类别	CPCI-S
会议主办者	chinese inst elect.; ieee beijing sect.; ieee elect devices soc.; ieee eds beijing chapter.; ieee solid-state circuits soc.; ieee sscs beijing chapter.; japan soc appl phys.; iee elect div.; ursi commiss d.; inst elect engineers korea.; natl nat sci fdn china.; beijing municipal bureau ind dev.; peking univ.
会议录	20047th international conference on solid-state and integrated circuits technology
会议录出版者	ieee ; 345 e 47th st, new york, ny 10017 usa
会议录出版地	345 e 47th st, new york, ny 10017 usa
学科主题	光电子学
语种	英语
ISBN号	0-7803-8511-x
内容类型	会议论文
源URL	[http://ir.semi.ac.cn/handle/172111/10098]
专题	半导体研究所_中国科学院半导体研究所（2009年前）
推荐引用方式 GB/T 7714	Tian, K,Liu, YL,Wang, QM. A practical package technique for FBG-based temperature independent sensor[C]. 见:7th international conference on solid-state and integrated circuits technology. beijing, peoples r china. oct 18-21, 2004.