Microwave packaging for 10 Gb/s EML modulators - art. no. 60201O
Liu, Y ; Xie, L ; Yuan, HQ ; Zhang, JB ; Zhu, NH ; Sun, CZ ; Xiong, B ; Luo, B
2005
会议名称conference on optoelectronic materials and devices for optical communications
会议日期nov 07-10, 2005
会议地点shanghai, peoples r china
关键词optoelectronic devices electro-absorption modulators microwave packaging frequency response DESIGN
页码6020: o201-o201
通讯作者liu, y, chinese acad sci, inst semicond, state key lab integrated optoelect, beijing 100083, peoples r china.
中文摘要a novel microwave packaging technique for 10gb/s electro-absorption modulator integrated with distributed feedback laser (eml) is presented. the packaging parasitics and intrinsic parasitics are both well considered, and the packaging circuit was synthetically designed to compensate for the intrinsic parasitic of the chip. a butterfly-packaged emi module has been successfully developed to prove that. the small-signal modulation bandwidth of the butterfly-packaged module is about 10 ghz. optical fiber transmission experiments have shown that the module can be used for 10gb/s optical transmission system. after transmission through 40km,. the power penalty is less than 1 dbm at a bit-error-rate of 10-12.
英文摘要a novel microwave packaging technique for 10gb/s electro-absorption modulator integrated with distributed feedback laser (eml) is presented. the packaging parasitics and intrinsic parasitics are both well considered, and the packaging circuit was synthetically designed to compensate for the intrinsic parasitic of the chip. a butterfly-packaged emi module has been successfully developed to prove that. the small-signal modulation bandwidth of the butterfly-packaged module is about 10 ghz. optical fiber transmission experiments have shown that the module can be used for 10gb/s optical transmission system. after transmission through 40km,. the power penalty is less than 1 dbm at a bit-error-rate of 10-12.; zhangdi于2010-03-29批量导入; made available in dspace on 2010-03-29t06:06:15z (gmt). no. of bitstreams: 1 2331.pdf: 471307 bytes, checksum: 4c4f0740bb229946ebc9f3cdc1d49830 (md5) previous issue date: 2005; spie.; chinese opt soc.; china inst commun.; shanghai jiao tong univ.; alcatel shanghai bell.; shanghai inst opt & fine mech.; photon bridges.; ieee commun soc.; ieee leos.; opt soc amer.; huawei technol.; chinese acad sci, inst semicond, state key lab integrated optoelect, beijing 100083, peoples r china
收录类别CPCI-S
会议主办者spie.; chinese opt soc.; china inst commun.; shanghai jiao tong univ.; alcatel shanghai bell.; shanghai inst opt & fine mech.; photon bridges.; ieee commun soc.; ieee leos.; opt soc amer.; huawei technol.
会议录optoelectronic materials and devices for optical communications丛书标题: proceedings of the society of photo-optical instrumentation engineers (spie)
会议录出版者spie-int soc optical engineering ; 1000 20th st, po box 10, bellingham, wa 98227-0010 usa
会议录出版地1000 20th st, po box 10, bellingham, wa 98227-0010 usa
学科主题光电子学
语种英语
ISSN号0277-786x
ISBN号0-8194-6051-6
内容类型会议论文
源URL[http://ir.semi.ac.cn/handle/172111/9898]  
专题半导体研究所_中国科学院半导体研究所(2009年前)
推荐引用方式
GB/T 7714
Liu, Y,Xie, L,Yuan, HQ,et al. Microwave packaging for 10 Gb/s EML modulators - art. no. 60201O[C]. 见:conference on optoelectronic materials and devices for optical communications. shanghai, peoples r china. nov 07-10, 2005.
个性服务
查看访问统计
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。


©版权所有 ©2017 CSpace - Powered by CSpace