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	Effect of thermal cycling on microstructure evolution and elements diffusion behavior near the interface of Ni/NiAl diffusion couple
	Gong, Xueyuan; Ma, Yue; Guo, Hongbo; Gong, Shengkai
刊名	JOURNAL OF ALLOYS AND COMPOUNDS
	2015
卷号	642页码:117-123
关键词	Intermetallics Diffusion Microstructure
ISSN号	0925-8388
DOI	10.1016/j.jallcom.2015.04.095
URL标识	查看原文
收录类别	SCIE ; EI
WOS记录号	WOS:000354577300018
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/6540312
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Gong, Xueyuan,Ma, Yue,Guo, Hongbo,et al. Effect of thermal cycling on microstructure evolution and elements diffusion behavior near the interface of Ni/NiAl diffusion couple[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2015,642:117-123.
APA	Gong, Xueyuan,Ma, Yue,Guo, Hongbo,&Gong, Shengkai.(2015).Effect of thermal cycling on microstructure evolution and elements diffusion behavior near the interface of Ni/NiAl diffusion couple.JOURNAL OF ALLOYS AND COMPOUNDS,642,117-123.
MLA	Gong, Xueyuan,et al."Effect of thermal cycling on microstructure evolution and elements diffusion behavior near the interface of Ni/NiAl diffusion couple".JOURNAL OF ALLOYS AND COMPOUNDS 642(2015):117-123.

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