| Failure Analysis of Plastic Encapsulated Microcircuits During Burn-in of Screening Test | |
| Jia, Meisi; Zhang, Sujuan | |
| 2015 | |
| 会议名称 | PROCEEDINGS OF THE 2015 FIRST INTERNATIONAL CONFERENCE ON RELIABILITY SYSTEMS ENGINEERING 2015 ICRSE |
| 会议日期 | 2015-01-01 |
| 关键词 | burn-in screening delamination failure analysis plastic encapsulated microcircuits (PEMs) design for packaging reliability |
| 收录类别 | EI ; CPCI-S |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000380485700005 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6537293 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Jia, Meisi,Zhang, Sujuan. Failure Analysis of Plastic Encapsulated Microcircuits During Burn-in of Screening Test[C]. 见:PROCEEDINGS OF THE 2015 FIRST INTERNATIONAL CONFERENCE ON RELIABILITY SYSTEMS ENGINEERING 2015 ICRSE. 2015-01-01. |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论