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	Combining physical embedding and covalent bonding for stable encapsulation of quantum dots into agarose hydrogels
	Liu, JB; Yang, XH; Wang, KM; Wang, Q; Ji, HN; Wu, CL; Li, J; He, XX; Tang, JL; Huang, J
刊名	Journal of Materials Chemistry
	2012
卷号	Vol.22 No.2页码:495-501
ISSN号	0959-9428
URL标识	查看原文
公开日期	[db:dc_date_available]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/6506649
专题	湖南大学
作者单位	Hunan Univ, Key Lab Bionanotechnol & Mol Engn Hunan Prov, State Key Lab Chemol Biosensing & Chemometr, Coll Chem & Chem Engn, Changsha 410082, Hunan, Peoples R China
推荐引用方式 GB/T 7714	Liu, JB,Yang, XH,Wang, KM,et al. Combining physical embedding and covalent bonding for stable encapsulation of quantum dots into agarose hydrogels[J]. Journal of Materials Chemistry,2012,Vol.22 No.2:495-501.
APA	Liu, JB.,Yang, XH.,Wang, KM.,Wang, Q.,Ji, HN.,...&Huang, J.(2012).Combining physical embedding and covalent bonding for stable encapsulation of quantum dots into agarose hydrogels.Journal of Materials Chemistry,Vol.22 No.2,495-501.
MLA	Liu, JB,et al."Combining physical embedding and covalent bonding for stable encapsulation of quantum dots into agarose hydrogels".Journal of Materials Chemistry Vol.22 No.2(2012):495-501.

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