Development of current-based microscopic defect analysis method using optical filling techniques for the defect study on heavily irradiated high-resistivity Si sensors/detectors | |
Li Z (Li Z.) ; Li CJ (Li C. J.) | |
刊名 | materials science in semiconductor processing |
2006 | |
卷号 | 9期号:1-3页码:283-287 |
关键词 | DLTS defects detectors sensors current transient SILICON DETECTORS |
ISSN号 | 1369-8001 |
通讯作者 | li, z, brookhaven natl lab, upton, ny 11973 usa. e-mail: zhengl@bnl.gov |
中文摘要 | current-based microscopic defect analysis method such as current deep level transient spectroscopy (i-dlts) and thermally stimulated current have been developed over the years at brookhaven national laboratory (bnl) for the defect characterizations on heavily irradiated (phi(n) >= 10(13) n/cm(2)) high-resistivity (>= 2 k omega cm) si sensors/detectors. the conventional dlts method using a capacitance transient is not valid on heavily irradiated high-resistivity si sensors/detectors. a new optical filling method, using lasers with various wavelengths, has been applied, which is more efficient and suitable than the traditional voltage-pulse filling. optimum defect-filling schemes and conditions have been suggested for heavily irradiated high-resistivity si sensors/detectors. (c) 2006 published by elsevier ltd. |
学科主题 | 半导体材料 |
收录类别 | SCI |
语种 | 英语 |
公开日期 | 2010-04-11 |
内容类型 | 期刊论文 |
源URL | [http://ir.semi.ac.cn/handle/172111/10540] |
专题 | 半导体研究所_中国科学院半导体研究所(2009年前) |
推荐引用方式 GB/T 7714 | Li Z ,Li CJ . Development of current-based microscopic defect analysis method using optical filling techniques for the defect study on heavily irradiated high-resistivity Si sensors/detectors[J]. materials science in semiconductor processing,2006,9(1-3):283-287. |
APA | Li Z ,&Li CJ .(2006).Development of current-based microscopic defect analysis method using optical filling techniques for the defect study on heavily irradiated high-resistivity Si sensors/detectors.materials science in semiconductor processing,9(1-3),283-287. |
MLA | Li Z ,et al."Development of current-based microscopic defect analysis method using optical filling techniques for the defect study on heavily irradiated high-resistivity Si sensors/detectors".materials science in semiconductor processing 9.1-3(2006):283-287. |
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