Improvement of the radiation hardness of SIMOX buried layers using nitrogen implantation | |
Zheng ZS ; Liu ZL ; Zhang GQ ; Li N ; Li GH ; Ma HZ ; Zhang EX ; Zhang ZX ; Wang X | |
刊名 | semiconductor science and technology
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2005 | |
卷号 | 20期号:6页码:481-484 |
关键词 | OXIDES |
ISSN号 | 0268-1242 |
通讯作者 | zheng, zs, chinese acad sci, inst semicond, microelect r&d ctr, beijing 100083, peoples r china. 电子邮箱地址: zszheng@red.semi.ac.cn |
中文摘要 | an investigation of hardening the buried oxides (box) in separation by implanted oxygen (simox) silicon-on-insulator (soi) wafers to total-dose irradiation has been made by implanting nitrogen into the box layers with a constant dose at different implantation energies. the total-dose radiation hardness of the box layers is characterized by the high frequency capacitance-voltage (c-v) technique. the experimental results show that the implantation of nitrogen into the box layers can increase the box hardness to total-dose irradiation. particularly, the implantation energy of nitrogen ions plays an important role in improving the radiation hardness of the box layers. the optimized implantation energy being used for a nitrogen dose, the hardness of box can be considerably improved. in addition, the c-v results show that there are differences between the box capacitances due to the different nitrogen implantation energies. |
学科主题 | 微电子学 |
收录类别 | SCI |
语种 | 英语 |
公开日期 | 2010-03-17 |
内容类型 | 期刊论文 |
源URL | [http://ir.semi.ac.cn/handle/172111/8644] ![]() |
专题 | 半导体研究所_中国科学院半导体研究所(2009年前) |
推荐引用方式 GB/T 7714 | Zheng ZS,Liu ZL,Zhang GQ,et al. Improvement of the radiation hardness of SIMOX buried layers using nitrogen implantation[J]. semiconductor science and technology,2005,20(6):481-484. |
APA | Zheng ZS.,Liu ZL.,Zhang GQ.,Li N.,Li GH.,...&Wang X.(2005).Improvement of the radiation hardness of SIMOX buried layers using nitrogen implantation.semiconductor science and technology,20(6),481-484. |
MLA | Zheng ZS,et al."Improvement of the radiation hardness of SIMOX buried layers using nitrogen implantation".semiconductor science and technology 20.6(2005):481-484. |
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