Fully front-side bulk-micromachined single-chip micro flow sensors for bare-chip SMT (surface mounting technology) packaging

	Fully front-side bulk-micromachined single-chip micro flow sensors for bare-chip SMT (surface mounting technology) packaging
	Liu, JD ; Wang, JC ; Li, XX
刊名	JOURNAL OF MICROMECHANICS AND MICROENGINEERING
	2012
卷号	22 期号:3 页码:35020
ISSN号	0960-1317
通讯作者	Li, XX (reprint author), Shanghai Jiao Tong Univ, Res Inst Micro Nano Sci & Technol, Shanghai 200240, Peoples R China.
中文摘要	This paper reports novel single-wafer-based piezoresistive micro flow sensors, which are bulk micromachined only from the front side of the silicon wafer to facilitate the sensor-bare chips directly packaged into micro-fluidic systems with low-cost surfac
学科主题	Engineering; Science & Technology - Other Topics; Instruments & Instrumentation; Materials Science; Mechanics
收录类别	2012SCI-175
原文出处	10.1088/0960-1317/22/3/035020
语种	英语
公开日期	2013-04-23
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/114925]
专题	上海微系统与信息技术研究所_微系统技术_期刊论文
推荐引用方式 GB/T 7714	Liu, JD,Wang, JC,Li, XX. Fully front-side bulk-micromachined single-chip micro flow sensors for bare-chip SMT (surface mounting technology) packaging[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2012,22(3):35020.
APA	Liu, JD,Wang, JC,&Li, XX.(2012).Fully front-side bulk-micromachined single-chip micro flow sensors for bare-chip SMT (surface mounting technology) packaging.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,22(3),35020.
MLA	Liu, JD,et al."Fully front-side bulk-micromachined single-chip micro flow sensors for bare-chip SMT (surface mounting technology) packaging".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 22.3(2012):35020.