QQ客服 官方微博 反馈留言

	The growth behavior of intermetallic compound layer of Sn-Ag-Cu/Cu interface during soldering
	Yu, D.Q.; Wang, J.H.; Wang, L.
	2005
会议名称	Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC
会议日期	2005-03-15
页码	86-90
会议录	Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/6178551
专题	大连理工大学
作者单位	Department of Material and Engineering, Dalian University of Technology, Dalian 116023, China
推荐引用方式 GB/T 7714	Yu, D.Q.,Wang, J.H.,Wang, L.. The growth behavior of intermetallic compound layer of Sn-Ag-Cu/Cu interface during soldering[C]. 见:Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC. 2005-03-15.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。