| RESIDUAL STRESS EVALUATION IN MACHINED SURFACES OF COPPER BY MOLECULAR DYNAMIC SIMULATION | |
| Wang, Yachao; Ji, Chunhui; Shi, Jing; Liu, Zhanqiang | |
| 2013 | |
| 会议名称 | ASME International Mechanical Engineering Congress and Exposition |
| 会议日期 | NOV 09-15, 2012 |
| 关键词 | Nano-scale machining MD simulation Cutting force Stress distribution Chip morphology Residual stress |
| 页码 | 1061-1069 |
| 收录类别 | CPCI-S |
| 会议录 | INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2012, VOL 3, PTS A-C: DESIGN, MATERIALS, AND MANUFACTURING
 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6045551 |
| 专题 | 山东大学 |
| 作者单位 | 1.N Dakota State Univ, Ind & Mfg Engn Dept, Fargo, ND 58105 USA. 2.Shandong Univ, Sch Mech Engn |
| 推荐引用方式 GB/T 7714 | Wang, Yachao,Ji, Chunhui,Shi, Jing,et al. RESIDUAL STRESS EVALUATION IN MACHINED SURFACES OF COPPER BY MOLECULAR DYNAMIC SIMULATION[C]. 见:ASME International Mechanical Engineering Congress and Exposition. NOV 09-15, 2012. |
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