| Third-Order Polynomials Model for Analyzing Multilayer Hard/Soft Materials in Flexible Electronics | |
| Meng, Xianhong; Liu, Boya; Wang, Yu; Zhang, Taihua; Xiao, Jianliang | |
| 刊名 | JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME
 |
| 2016 | |
| 卷号 | 83 |
| 关键词 | flexible electronics hard and soft materials third-order polynomials zigzag |
| ISSN号 | 0021-8936 |
| DOI | 10.1115/1.4033754 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; EI |
| WOS记录号 | WOS:000382750800011 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5958845 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Meng, Xianhong,Liu, Boya,Wang, Yu,et al. Third-Order Polynomials Model for Analyzing Multilayer Hard/Soft Materials in Flexible Electronics[J]. JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME,2016,83. |
| APA | Meng, Xianhong,Liu, Boya,Wang, Yu,Zhang, Taihua,&Xiao, Jianliang.(2016).Third-Order Polynomials Model for Analyzing Multilayer Hard/Soft Materials in Flexible Electronics.JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME,83. |
| MLA | Meng, Xianhong,et al."Third-Order Polynomials Model for Analyzing Multilayer Hard/Soft Materials in Flexible Electronics".JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME 83(2016). |
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