CORC  > 北京航空航天大学
Simulation of Electromigration induced stress of solder
Su, Fei; Pan, Xiaoxu; Zhang, Zheng; Liu, Qingyi
2016
会议名称37th IEEE International Electronics Manufacturing Technology Conference (IEMT) / 18th Electronics Materials and Packaging (EMAP) Conference
会议日期2016-09-20
会议地点MALAYSIA
关键词Electromigration Stress Solder finite element
卷号2016-November
收录类别EI ; CPCI-S
URL标识查看原文
WOS记录号WOS:000403597000010
内容类型会议论文
URI标识http://www.corc.org.cn/handle/1471x/5950153
专题北京航空航天大学
推荐引用方式
GB/T 7714
Su, Fei,Pan, Xiaoxu,Zhang, Zheng,et al. Simulation of Electromigration induced stress of solder[C]. 见:37th IEEE International Electronics Manufacturing Technology Conference (IEMT) / 18th Electronics Materials and Packaging (EMAP) Conference. MALAYSIA. 2016-09-20.
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