| Storage Life Modeling and Analysis for Contacting Slip Ring Based on Physics of Failure | |
| Zhang, Jianchun; Ma, Xiaobing; Cheng, Bo; Zhao, Yu | |
| 刊名 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
 |
| 2017 | |
| 卷号 | 7页码:1969-1980 |
| 关键词 | Contact resistance contacting slip ring reliability storage life stress relaxation thin-film growth |
| ISSN号 | 2156-3950 |
| DOI | 10.1109/TCPMT.2017.2751583 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE |
| WOS记录号 | WOS:000418771500006 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5945838 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Zhang, Jianchun,Ma, Xiaobing,Cheng, Bo,et al. Storage Life Modeling and Analysis for Contacting Slip Ring Based on Physics of Failure[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2017,7:1969-1980. |
| APA | Zhang, Jianchun,Ma, Xiaobing,Cheng, Bo,&Zhao, Yu.(2017).Storage Life Modeling and Analysis for Contacting Slip Ring Based on Physics of Failure.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,7,1969-1980. |
| MLA | Zhang, Jianchun,et al."Storage Life Modeling and Analysis for Contacting Slip Ring Based on Physics of Failure".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 7(2017):1969-1980. |
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