| A design and qualification of LED flip Chip-on-Board module with tunable color temperatures | |
| Fan, Jiajie; Cao, Jianwu; Yu, Chaohua; Qian, Cheng; Fan, Xuejun; Zhang, Guoqi | |
| 刊名 | MICROELECTRONICS RELIABILITY
 |
| 2018 | |
| 卷号 | 84页码:140-148 |
| 关键词 | LED Wafer level chip scale package Chip-on-Board Tunable color temperatures Luminous flux modeling |
| ISSN号 | 0026-2714 |
| DOI | 10.1016/j.microrel.2018.03.033 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; EI |
| WOS记录号 | WOS:000431939000017 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5934475 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Fan, Jiajie,Cao, Jianwu,Yu, Chaohua,et al. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures[J]. MICROELECTRONICS RELIABILITY,2018,84:140-148. |
| APA | Fan, Jiajie,Cao, Jianwu,Yu, Chaohua,Qian, Cheng,Fan, Xuejun,&Zhang, Guoqi.(2018).A design and qualification of LED flip Chip-on-Board module with tunable color temperatures.MICROELECTRONICS RELIABILITY,84,140-148. |
| MLA | Fan, Jiajie,et al."A design and qualification of LED flip Chip-on-Board module with tunable color temperatures".MICROELECTRONICS RELIABILITY 84(2018):140-148. |
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