| Ruggedness Characterization of Bonding Wire Arrays in LDMOSFET-Based Power Amplifiers | |
| Lin, Liang; Hua, Yu-Jie; Zhou, Liang; Wu, Qi; Mao, Junfa; Yin, Wen-Yan | |
| 刊名 | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
 |
| 2018 | |
| 卷号 | 8页码:1032-1041 |
| 关键词 | Bonding wire array breakdown temperature electro-thermo-stress (ETS) finite-element method (FEM) laterally diffused metal oxide semiconductor (LDMOS) power amplifier (PA) ruggedness testing thermal and stress failure |
| ISSN号 | 2156-3950 |
| DOI | 10.1109/TCPMT.2017.2773624 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; EI |
| WOS记录号 | WOS:000434471600015 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5934008 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Lin, Liang,Hua, Yu-Jie,Zhou, Liang,et al. Ruggedness Characterization of Bonding Wire Arrays in LDMOSFET-Based Power Amplifiers[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8:1032-1041. |
| APA | Lin, Liang,Hua, Yu-Jie,Zhou, Liang,Wu, Qi,Mao, Junfa,&Yin, Wen-Yan.(2018).Ruggedness Characterization of Bonding Wire Arrays in LDMOSFET-Based Power Amplifiers.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,8,1032-1041. |
| MLA | Lin, Liang,et al."Ruggedness Characterization of Bonding Wire Arrays in LDMOSFET-Based Power Amplifiers".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 8(2018):1032-1041. |
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