Large-scale ultra-adhesive and mechanically flexible silver grids transparent electrodes by solution process | |
Wang, Qingxia; Hu, Xiaotian; Yang, Xia; Liu, Gengling; Meng, Xiangchuan; Xie, Yuanpeng; Xiao, Yingbo; Liu, Jinliang; Tan, Licheng; Chen, Yiwang | |
刊名 | ORGANIC ELECTRONICS |
2018 | |
卷号 | 61页码:296-303 |
关键词 | Flexibility Solution process Ultra-adhesion Transparent electrodes Optoelectronics |
ISSN号 | 1566-1199 |
DOI | 10.1016/j.orgel.2018.06.007 |
URL标识 | 查看原文 |
收录类别 | SCIE |
WOS记录号 | WOS:000438894600037 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/5931344 |
专题 | 北京航空航天大学 |
推荐引用方式 GB/T 7714 | Wang, Qingxia,Hu, Xiaotian,Yang, Xia,et al. Large-scale ultra-adhesive and mechanically flexible silver grids transparent electrodes by solution process[J]. ORGANIC ELECTRONICS,2018,61:296-303. |
APA | Wang, Qingxia.,Hu, Xiaotian.,Yang, Xia.,Liu, Gengling.,Meng, Xiangchuan.,...&Chen, Yiwang.(2018).Large-scale ultra-adhesive and mechanically flexible silver grids transparent electrodes by solution process.ORGANIC ELECTRONICS,61,296-303. |
MLA | Wang, Qingxia,et al."Large-scale ultra-adhesive and mechanically flexible silver grids transparent electrodes by solution process".ORGANIC ELECTRONICS 61(2018):296-303. |
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