| Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module | |
| Lu, Libin; Zhang, Zhen; Guan, Yingchun; Zheng, Hongyu | |
| 刊名 | POLYMERS
 |
| 2018 | |
| 卷号 | 10 |
| 关键词 | laser surface texturing heat dissipation heat sink LED chip flexible electronics |
| ISSN号 | 2073-4360 |
| DOI | 10.3390/polym10080886 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; PUBMED |
| WOS记录号 | WOS:000445410200079 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5929941 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Lu, Libin,Zhang, Zhen,Guan, Yingchun,et al. Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module[J]. POLYMERS,2018,10. |
| APA | Lu, Libin,Zhang, Zhen,Guan, Yingchun,&Zheng, Hongyu.(2018).Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module.POLYMERS,10. |
| MLA | Lu, Libin,et al."Enhancement of Heat Dissipation by Laser Micro Structuring for LED Module".POLYMERS 10(2018). |
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