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	Development of an infrared polarized microscope for evaluation of high gradient stress with a small distribution area on a silicon chip
	Su, Fei; Li, Tenghui
刊名	REVIEW OF SCIENTIFIC INSTRUMENTS
	2019
卷号	90页码:063108
关键词	Birefringence Electronics packaging Light polarization Optical devices Silicon Thermal cycling Three dimensional integrated circuits Distribution area High gradient stress Phase difference Phase-shifting technique Polarized microscope Quarter wave-plate Stress birefringence Through silicon vias Vibrations (mechanical)
ISSN号	0034-6748
DOI	10.1063/1.5086891
URL标识	查看原文
收录类别	SCIE ; EI ; PUBMED
WOS记录号	WOS:000474601100021
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5918656
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Su, Fei,Li, Tenghui. Development of an infrared polarized microscope for evaluation of high gradient stress with a small distribution area on a silicon chip[J]. REVIEW OF SCIENTIFIC INSTRUMENTS,2019,90:063108.
APA	Su, Fei,&Li, Tenghui.(2019).Development of an infrared polarized microscope for evaluation of high gradient stress with a small distribution area on a silicon chip.REVIEW OF SCIENTIFIC INSTRUMENTS,90,063108.
MLA	Su, Fei,et al."Development of an infrared polarized microscope for evaluation of high gradient stress with a small distribution area on a silicon chip".REVIEW OF SCIENTIFIC INSTRUMENTS 90(2019):063108.

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