| Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics | |
| Shi, Yingli; Wang, Chengjun; Yin, Yafei; Li, Yuhang; Xing, Yufeng; Song, Jizhou | |
| 刊名 | ADVANCED FUNCTIONAL MATERIALS
 |
| 2019 | |
| 卷号 | 29 |
| 关键词 | functional composite phase change material thermal management wearable electronics |
| ISSN号 | 1616-301X |
| DOI | 10.1002/adfm.201905470 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; EI |
| WOS记录号 | WOS:000484339700001 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/5915079 |
| 专题 | 北京航空航天大学 |
| 推荐引用方式 GB/T 7714 | Shi, Yingli,Wang, Chengjun,Yin, Yafei,et al. Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics[J]. ADVANCED FUNCTIONAL MATERIALS,2019,29. |
| APA | Shi, Yingli,Wang, Chengjun,Yin, Yafei,Li, Yuhang,Xing, Yufeng,&Song, Jizhou.(2019).Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics.ADVANCED FUNCTIONAL MATERIALS,29. |
| MLA | Shi, Yingli,et al."Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics".ADVANCED FUNCTIONAL MATERIALS 29(2019). |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论