CORC  > 武汉轻工大学
The preparation and the reliability study of an anisotropic conductive paste (ACP) for RFID tag inlays' packaging
Cai, Xiong-hui*; Zhai, Ai-xia; Cheng, Chuan-song
2013
会议名称14th International Conference on Electronic Packaging Technology (ICEPT)
会议日期AUG 11-14, 2013
会议地点Chinese Inst Elect, Dalian, PEOPLES R CHINA
关键词radio frequency identification anisotropic conductive paste flip-chip reliability
页码368-+
会议录2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
URL标识查看原文
WOS记录号WOS:000349907100084
内容类型会议论文
URI标识http://www.corc.org.cn/handle/1471x/5585775
专题武汉轻工大学
作者单位1.[Cai, Xiong-hui
2.Cheng, Chuan-song] Wuhan Polytech Univ, Coll Biol & Pharmaceut Engn, Wuhan 430023, Hubei, Peoples R China.
推荐引用方式
GB/T 7714
Cai, Xiong-hui*,Zhai, Ai-xia,Cheng, Chuan-song. The preparation and the reliability study of an anisotropic conductive paste (ACP) for RFID tag inlays' packaging[C]. 见:14th International Conference on Electronic Packaging Technology (ICEPT). Chinese Inst Elect, Dalian, PEOPLES R CHINA. AUG 11-14, 2013.
个性服务
查看访问统计
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。


©版权所有 ©2017 CSpace - Powered by CSpace