The preparation and the reliability study of an anisotropic conductive paste (ACP) for RFID tag inlays' packaging | |
Cai, Xiong-hui*; Zhai, Ai-xia; Cheng, Chuan-song | |
2013 | |
会议名称 | 14th International Conference on Electronic Packaging Technology (ICEPT) |
会议日期 | AUG 11-14, 2013 |
会议地点 | Chinese Inst Elect, Dalian, PEOPLES R CHINA |
关键词 | radio frequency identification anisotropic conductive paste flip-chip reliability |
页码 | 368-+ |
会议录 | 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
URL标识 | 查看原文 |
WOS记录号 | WOS:000349907100084 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/5585775 |
专题 | 武汉轻工大学 |
作者单位 | 1.[Cai, Xiong-hui 2.Cheng, Chuan-song] Wuhan Polytech Univ, Coll Biol & Pharmaceut Engn, Wuhan 430023, Hubei, Peoples R China. |
推荐引用方式 GB/T 7714 | Cai, Xiong-hui*,Zhai, Ai-xia,Cheng, Chuan-song. The preparation and the reliability study of an anisotropic conductive paste (ACP) for RFID tag inlays' packaging[C]. 见:14th International Conference on Electronic Packaging Technology (ICEPT). Chinese Inst Elect, Dalian, PEOPLES R CHINA. AUG 11-14, 2013. |
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