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	Analysis of packaging material impacting on FBG temperature sensors
	Wang, Wen-Hua[1]; Feng, Yun-Jun[1]; Shi, Wen-Qing[1]; Xiong, Zheng-Ye[1]; Li, Si-Dong[1]; Wu, Weina[2]; Lin, Weina[3]
	October 19, 2009 - October 21, 2009
会议日期	October 19, 2009 - October 21, 2009
会议地点	Shanghai, China
会议录	2009 International Conference on Optical Instruments and Technology - Advanced Sensor Technologies and Applications
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/5489332
专题	广东海洋大学
作者单位	1.[1] School of Science, Guangdong Ocean University, Zhanjiang 524088, China 2.[2] Department of Experiment and Teaching, Guangdong Ocean University, Zhanjiang 524088, China 3.[3] School of Physics and Optoelectronic Engineering, Dalian University of Technology, Dalian 116024, China
推荐引用方式 GB/T 7714	Wang, Wen-Hua[1],Feng, Yun-Jun[1],Shi, Wen-Qing[1],et al. Analysis of packaging material impacting on FBG temperature sensors[C]. 见:. Shanghai, China. October 19, 2009 - October 21, 2009.

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