Going Cooler With Timing-Constrained TeSHoP: A Temperature Sensing-Based Hotspot-Driven Placement Technique for FPGAs | |
Lu, Weina1,2; Hu, Yu1,2; Ye, Jing1; Li, Xiaowei1,2 | |
刊名 | IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS |
2017-09-01 | |
卷号 | 25期号:9页码:2525-2537 |
关键词 | Computer-aided design flow field-programmable gate arrays (FPGAs) hotspot optimization performance |
ISSN号 | 1063-8210 |
DOI | 10.1109/TVLSI.2017.2707120 |
英文摘要 | The continuous shrinking of the feature size in CMOS technology has significantly increased the power densities of integrated circuits, leading to severe temperature issues. However, the previous offline simulation-based thermal optimization works cast large deviations with the reality, while online sensing-based thermal managements usually incur significant performance overhead. Therefore, it is crucial to propose a method that could achieve fine-grained optimization with accurate temperature profiles. In this paper, we propose a timingconstraint temperature sensing-based hotspot-driven placement technique for field-programmable gate arrays (FPGAs). The hotspot optimization issue is modeled as a hyper minimum bipartite matching problem and is solved by a place adjustment with the input of an online sensed temperature profile. We propose an open-source/commercial hybrid design flow to implement the whole optimization in Xilinx Virtex-6 FPGA. Experimental results demonstrate a significant reduction in peak temperature and a great improvement on thermal uniformity, with slight performance overhead under timing constraints. |
资助项目 | National Natural Science Foundation of China[61274030] ; National Natural Science Foundation of China[61532017] ; National Natural Science Foundation of China[61376043] ; National Natural Science Foundation of China[61521092] |
WOS研究方向 | Computer Science ; Engineering |
语种 | 英语 |
出版者 | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
WOS记录号 | WOS:000408425400013 |
内容类型 | 期刊论文 |
源URL | [http://119.78.100.204/handle/2XEOYT63/6668] |
专题 | 中国科学院计算技术研究所期刊论文_英文 |
通讯作者 | Hu, Yu |
作者单位 | 1.Chinese Acad Sci, Inst Comp Technol, State Key Lab Comp Architecture, Beijing 100190, Peoples R China 2.Chinese Acad Sci, Grad Univ, Beijing 100080, Peoples R China |
推荐引用方式 GB/T 7714 | Lu, Weina,Hu, Yu,Ye, Jing,et al. Going Cooler With Timing-Constrained TeSHoP: A Temperature Sensing-Based Hotspot-Driven Placement Technique for FPGAs[J]. IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS,2017,25(9):2525-2537. |
APA | Lu, Weina,Hu, Yu,Ye, Jing,&Li, Xiaowei.(2017).Going Cooler With Timing-Constrained TeSHoP: A Temperature Sensing-Based Hotspot-Driven Placement Technique for FPGAs.IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS,25(9),2525-2537. |
MLA | Lu, Weina,et al."Going Cooler With Timing-Constrained TeSHoP: A Temperature Sensing-Based Hotspot-Driven Placement Technique for FPGAs".IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS 25.9(2017):2525-2537. |
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