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	Bonding Strength of Magnetron Sputtered Nanometer Copper Thin Film after Laser Shock Processing
	Xue, Qing[1]; Ni, Ze-Yan[2]; Hua, Yin-Qun[3]; Chen, Rui-Fang[4]; Liu, Hai-Xia[5]; Ye, Yun-Xia[6]
	2016
会议名称	2016 INTERNATIONAL CONFERENCE ON MATERIALS SCIENCE AND ENGINEERING APPLICATION (ICMSEA 2016)
关键词	Magnetron sputtering Laser shock processing Bonding strength Copper film
页码	375-383
收录类别	CPCI-S
URL标识	查看原文
WOS记录号	WOS:000390841800062
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/5357387
专题	江苏大学
作者单位	1.[1]Jiangsu Univ, Sch Mech Engn, Zhenjiang 212013, Jiangsu, Peoples R China. 2.[2]Jiangsu Univ, Sch Mech Engn, Zhenjiang 212013, Jiangsu, Peoples R China. 3.[3]Jiangsu Univ, Sch Mat Sci & Engn, Zhenjiang 212013, Jiangsu, Peoples R China. 4.[4]Jiangsu Univ, Sch Mech Engn, Zhenjiang 212013, Jiangsu, Peoples R China. 5.[5]Jiangsu Univ, Sch Mat Sci & Engn, Zhenjiang 212013, Jiangsu, Peoples R China. 6.[6]Jiangsu Univ, Sch Mech Engn, Zhenjiang 212013, Jiangsu, Peoples R China.
推荐引用方式 GB/T 7714	Xue, Qing[1],Ni, Ze-Yan[2],Hua, Yin-Qun[3],et al. Bonding Strength of Magnetron Sputtered Nanometer Copper Thin Film after Laser Shock Processing[C]. 见:2016 INTERNATIONAL CONFERENCE ON MATERIALS SCIENCE AND ENGINEERING APPLICATION (ICMSEA 2016).

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